DocumentCode
1824095
Title
Relationship between moulding compounds and tribocharging in IC manufacturing and Tape & Reel shipment
Author
Christoforou, Yorgos ; Rattawat, Paiboon ; Seantumpol, Pitak ; Sukpitikul, Arkhom ; Mavinkurve, Amar ; Goumans, Leon
Author_Institution
NXP Semicond., Nijmegen, Netherlands
fYear
2011
fDate
11-16 Sept. 2011
Firstpage
1
Lastpage
10
Abstract
We present in this article a study of the triboelectric charging of two big moulding compound families against materials used at IC manufacturing and Tape & Reel shipment. The accumulated charge can, in marginal cases, lead to CDM type of damage if not controlled. Such a marginal case of failure through CDM ESD of an SO14 product is also discussed.
Keywords
electrostatic discharge; integrated circuit manufacture; integrated circuit packaging; integrated circuit reliability; moulding; triboelectricity; CDM ESD; CDM type damage; IC manufacturing; moulding compound; tape and reel shipment; tribocharging; triboelectric charging; Compounds; Integrated circuits; Manufacturing; Materials; Surface charging; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2011 33rd
Conference_Location
Anaheim, CA
ISSN
Pending
Electronic_ISBN
Pending
Type
conf
Filename
6045592
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