Title :
A contribution to the evaluation of HMM for IO design
Author :
Song, M.H. ; Smedes, T. ; Tseng, J.C. ; Chang, T.H. ; Derikx, R. ; Velghe, R.
Author_Institution :
TSMC, Hsinchu, Taiwan
Abstract :
An ESD gun measurement setup, including PCB/socket design and package selection, is presented. Measurements with this setup show a stable correlation with on-wafer HMM testing results. Also correlation factors with HBM and TLP are presented Case studies demonstrate that small details may have a significant effect on the results.
Keywords :
electric connectors; electronics packaging; electrostatic devices; electrostatic discharge; printed circuit design; ESD gun measurement setup; HBM correlation factors; HMM evaluation; IO design; PCB-socket design; TLP correlation factors; human metal model; on-wafer HMM testing; package selection; Correlation; Electrostatic discharge; Hidden Markov models; Impedance; Monitoring; Stress; Testing;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2011 33rd
Conference_Location :
Anaheim, CA
Electronic_ISBN :
Pending
