DocumentCode :
1824527
Title :
Gunn Diode Pulse Thermal Resistance and Characterization Test System
Author :
Anand, Y. ; Hoft, R.P.
Author_Institution :
M/A-COM Inc.
Volume :
8
fYear :
1985
fDate :
Dec. 1985
Firstpage :
114
Lastpage :
134
Abstract :
The thermal resistance test station provides a complete characterization of a GUNN diodes parameters. The output power, efficiency, frequency, power swept response, and thermal resistance measurements are made fast and accurately. The accuracy of present thermal resistance measurements of Ka-band GUNN diodes is ± 15%, better results are expected with the revised heating test. Measurement times of 2-3 minutes rather than 2-3 hours are required making it a production suitable method. The system expandability becomes apparent at the wafer level. The current versus voltage characteristics at ambient temperature may be able in distinguish between good and bad processed GaAs wafers. This will provide an obvious cost savings because inadequate wafers are withheld during processing or before packaging.
Keywords :
Diodes; Electrical resistance measurement; Frequency; Gunn devices; Power generation; Production; Resistance heating; System testing; Thermal resistance; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ARFTG Conference Digest-Winter, 26th ARFTG
Conference_Location :
Ontario, Canada
Print_ISBN :
0-7803-5686-1
Type :
conf
DOI :
10.1109/ARFTG.1985.323642
Filename :
4119053
Link To Document :
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