DocumentCode
1824527
Title
Gunn Diode Pulse Thermal Resistance and Characterization Test System
Author
Anand, Y. ; Hoft, R.P.
Author_Institution
M/A-COM Inc.
Volume
8
fYear
1985
fDate
Dec. 1985
Firstpage
114
Lastpage
134
Abstract
The thermal resistance test station provides a complete characterization of a GUNN diodes parameters. The output power, efficiency, frequency, power swept response, and thermal resistance measurements are made fast and accurately. The accuracy of present thermal resistance measurements of Ka-band GUNN diodes is ± 15%, better results are expected with the revised heating test. Measurement times of 2-3 minutes rather than 2-3 hours are required making it a production suitable method. The system expandability becomes apparent at the wafer level. The current versus voltage characteristics at ambient temperature may be able in distinguish between good and bad processed GaAs wafers. This will provide an obvious cost savings because inadequate wafers are withheld during processing or before packaging.
Keywords
Diodes; Electrical resistance measurement; Frequency; Gunn devices; Power generation; Production; Resistance heating; System testing; Thermal resistance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
ARFTG Conference Digest-Winter, 26th ARFTG
Conference_Location
Ontario, Canada
Print_ISBN
0-7803-5686-1
Type
conf
DOI
10.1109/ARFTG.1985.323642
Filename
4119053
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