• DocumentCode
    1824527
  • Title

    Gunn Diode Pulse Thermal Resistance and Characterization Test System

  • Author

    Anand, Y. ; Hoft, R.P.

  • Author_Institution
    M/A-COM Inc.
  • Volume
    8
  • fYear
    1985
  • fDate
    Dec. 1985
  • Firstpage
    114
  • Lastpage
    134
  • Abstract
    The thermal resistance test station provides a complete characterization of a GUNN diodes parameters. The output power, efficiency, frequency, power swept response, and thermal resistance measurements are made fast and accurately. The accuracy of present thermal resistance measurements of Ka-band GUNN diodes is ± 15%, better results are expected with the revised heating test. Measurement times of 2-3 minutes rather than 2-3 hours are required making it a production suitable method. The system expandability becomes apparent at the wafer level. The current versus voltage characteristics at ambient temperature may be able in distinguish between good and bad processed GaAs wafers. This will provide an obvious cost savings because inadequate wafers are withheld during processing or before packaging.
  • Keywords
    Diodes; Electrical resistance measurement; Frequency; Gunn devices; Power generation; Production; Resistance heating; System testing; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Winter, 26th ARFTG
  • Conference_Location
    Ontario, Canada
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1985.323642
  • Filename
    4119053