DocumentCode :
1824645
Title :
Structural properties of silicon oxide prepared by high-power PECVD
Author :
Sidorov, Denis I. ; Mushinsky, Sergey S. ; Shevtsov, Denis I.
Author_Institution :
Perm Sci.-Ind. Instrum. Making Co., Perm, Russia
fYear :
2013
fDate :
1-5 July 2013
Firstpage :
43
Lastpage :
45
Abstract :
The paper presents results of structure analysis of silicon oxide films prepared by plasma enhanced chemical vapor deposition (PECVD) methods with a high power plasma excitation. The films were deposited from hexamethyldisilazane and oxygen mixture. Dependences on deposition parameters are presented.
Keywords :
dielectric thin films; plasma CVD; silicon compounds; SiO; deposition parameters; hexamethyldisilazane-oxygen mixture; high power plasma excitation; high-power PECVD; plasma enhanced chemical vapor deposition; silicon oxide films; structure analysis; Atomic layer deposition; Educational institutions; Films; Plasmas; Silicon; Substrates; EDX; FTIR; PECVD; Thin films; silicon oxide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro/Nanotechnologies and Electron Devices (EDM), 2013 14th International Conference of Young Specialists on
Conference_Location :
Novosibirsk
ISSN :
2325-4173
Print_ISBN :
978-1-4799-0761-8
Type :
conf
DOI :
10.1109/EDM.2013.6641936
Filename :
6641936
Link To Document :
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