Title :
Microwave Connector Analysis Using Time Domain Circuit Modeling
Author :
Sletten, Robert J.
Author_Institution :
New Product Development, M/A-Com Omni Spectra, Inc.
Keywords :
Bandwidth; Connectors; Microcomputers; Microwave circuits; Packaging; Product development; Q measurement; Scattering parameters; Time domain analysis;
Conference_Titel :
ARFTG Conference Digest-Spring, 27th ARFTG
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1986.323666