Title :
Experimental 20 Gbit/s modules for optical fiber links
Author_Institution :
Deutsche Telekom AG, Darmstadt, Germany
Abstract :
For an experimental optical fiber transmission system working at 20 Gbit/s electronic transmitter and receiver modules were developed. To guarantee reliable and error free operation, unpackaged GaAs- and Si-chips on ceramic thin film substrates in combination with a sophisticated interconnection technique had to be used.
Keywords :
digital communication; hybrid integrated circuits; modules; optical fibre communication; optical receivers; optical transmitters; thin film circuits; 20 Gbit/s; 20 Gbit/s modules; GaAs; Si; ceramic thin film substrates; error free operation; interconnection technique; optical fiber links; receiver module; transmitter module; unpackaged GaAs chips; unpackaged Si chips; Circuits; Clocks; Microwave technology; Optical fibers; Optical modulation; Optical receivers; Optical signal processing; Optical transmitters; Signal processing; Stimulated emission;
Conference_Titel :
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3814-6
DOI :
10.1109/MWSYM.1997.604563
