DocumentCode :
1825230
Title :
Material and simulation technology for solid insulated switchgear
Author :
Shimizu, Tsuyoshi ; Kinoshita, S. ; Makishima, S. ; Sat, J. ; Sakaguchi, O.
Author_Institution :
Power & Ind. Syst. Res. & Dev. Center, Toshiba Corp., Tokyo, Japan
Volume :
3
fYear :
2003
fDate :
1-5 June 2003
Firstpage :
1194
Abstract :
We have developed solid insulated switchgear(SIS), which is designed for SF6-free innovative medium voltage applications. A new epoxy casting material is applied, which contains a great deal of spherical silica to reduce viscosity and increase mechanical strength. This material has the high glass transition temperature, which provides high thermal resistance and also high toughness for directly molding the vacuum interrupter. The switchgear consists of some complicated casting insulators such as bushings and cable heads. These insulators are manufactured by the high-cycle automatic pressure gelation method. The flow and cure analysis of the casting material visualizes the curing process inside the molds and suggests the best manufacturing conditions such as temperature, speed and time.
Keywords :
borosilicate glasses; bushings; electric strength; epoxy insulation; fracture toughness; glass transition; permittivity; switchgear insulation; thermal resistance; vacuum interrupters; viscosity; bushings; cable heads; casting insulators; casting material; cure analysis; epoxy casting material; glass transition temperature; high cycle automatic pressure gelation method; innovative medium voltage; mechanical strength; molding; silica; solid insulated switchgear; thermal resistance; toughness; vacuum interrupter; viscosity; Casting; Glass; Insulation; Medium voltage; Silicon compounds; Solid modeling; Switchgear; Temperature; Thermal resistance; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
ISSN :
1081-7735
Print_ISBN :
0-7803-7725-7
Type :
conf
DOI :
10.1109/ICPADM.2003.1218638
Filename :
1218638
Link To Document :
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