Air-gap transmission lines for OEICs and MMICs using glass substrates

Author

Chuang, J. ; El-Ghazaly, S.M. ; Schroder, D.K. ; Zhang, Y.H. ; Maracas, G.N. ; Reyes, A.C.

Author_Institution

Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA

Volume

1

fYear

1997

fDate

8-13 June 1997

Firstpage

265

Abstract

This paper describes transmission-line structures for optoelectronic integrated circuits (OEICs) and monolithic microwave integrated circuits (MMICs) using glass processing assisted microbump bonding (GPAMBB). Two different configurations of air-gap transmission lines are fabricated using this interconnection technique. Because the field distributions are mainly in air, these structures have the advantages of low losses, and low dispersion. Theoretical and experimental results of both structures are presented in this paper. The attenuation of the two air-gap transmission lines and the conventional CPW are compared over the 2 GHz-20 GHz range.

Keywords

MMIC; air gaps; coplanar waveguides; integrated circuit interconnections; integrated optoelectronics; microstrip lines; 2 to 20 GHz; GPAMBB; MMIC; OEIC; air-gap transmission line; glass processing assisted microbump bonding; glass substrate; interconnection; monolithic microwave integrated circuit; optoelectronic integrated circuit; Air gaps; Bonding; Distributed parameter circuits; Glass; Integrated circuit interconnections; MMICs; Microwave integrated circuits; Monolithic integrated circuits; Transmission line theory; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1997., IEEE MTT-S International

Conference_Location

Denver, CO, USA

ISSN

0149-645X

Print_ISBN

0-7803-3814-6

Type

conf

DOI

10.1109/MWSYM.1997.604570

Filename

604570