Title :
Applying spatiotemporal ICA with DEA approach in evaluating the training institution efficiency of the Semiconductor Institute program in Taiwan
Author :
Lu, Cheng-Chin ; Kao, Ling-Jing ; Chiu, Chih-Chou
Author_Institution :
Grad. Inst. of Ind. & Bus. Manage., Nat. Taipei Univ. of Technol., Taipei, Taiwan
Abstract :
In this paper, a two-stage approach of integrating spatiotemporal independent component analysis (stICA) and data envelopment analysis (DEA) is developed for efficiency measurement. stICA is used to search for latent source signals where no relevant signal mixture mechanisms are available; and DEA is used to measure the relative efficiencies of decision making units (DMUs). We suggest using stICA first to extract the input variables for generating independent components (IC), then selecting the ICs representing the independent sources of input variables, and finally inputting the selected ICs as new variables in the DEA model. The training institution dataset provided by the Semiconductor Institute in Taiwan is used for analysis. The result shows that the proposed method can not only separate performance differences between the training institutions but also improve the discriminatory capability of the DEA´s efficiency measurement. The study results can serve as a reference for training institutions wishing to enhance their training efficiency.
Keywords :
data envelopment analysis; decision making; independent component analysis; industrial training; semiconductor industry; DEA approach; Taiwan; data envelopment analysis; decision making units; high-tech industry; semiconductor institute program; spatiotemporal ICA approach; training institution efficiency; Biological system modeling; Computational modeling; Training; Data envelopment analysis; Efficiency measurement; Spatiotemporal independent component analysis;
Conference_Titel :
Industrial Engineering and Engineering Management (IEEM), 2010 IEEE International Conference on
Conference_Location :
Macao
Print_ISBN :
978-1-4244-8501-7
Electronic_ISBN :
2157-3611
DOI :
10.1109/IEEM.2010.5674379