DocumentCode
1825788
Title
Improved compaction of multilayer MMIC/MCM baluns using lumped element compensation
Author
Jansen, R.H. ; Jotzo, J. ; Engels, R.
Author_Institution
Dept. of Electr. Eng., Tech. Hochschule Aachen, Germany
Volume
1
fYear
1997
fDate
8-13 June 1997
Firstpage
277
Abstract
A novel lumped impedance matched type of Marchand balun in MMIC/MCM technology is described which is compact enough even for the low-GHz frequency range. Broadband performance and balance of this component are sufficient for the use in many wireless applications.
Keywords
MMIC; baluns; compensation; lumped parameter networks; multichip modules; Marchand balun; broadband performance; compaction; lumped element compensation; lumped impedance matched type; multilayer MMIC/MCM baluns; wireless applications; Compaction; Frequency; Impedance matching; MMICs; Nonhomogeneous media; Silicon; Space technology; Strips; Voltage; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location
Denver, CO, USA
ISSN
0149-645X
Print_ISBN
0-7803-3814-6
Type
conf
DOI
10.1109/MWSYM.1997.604573
Filename
604573
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