Title :
Improved compaction of multilayer MMIC/MCM baluns using lumped element compensation
Author :
Jansen, R.H. ; Jotzo, J. ; Engels, R.
Author_Institution :
Dept. of Electr. Eng., Tech. Hochschule Aachen, Germany
Abstract :
A novel lumped impedance matched type of Marchand balun in MMIC/MCM technology is described which is compact enough even for the low-GHz frequency range. Broadband performance and balance of this component are sufficient for the use in many wireless applications.
Keywords :
MMIC; baluns; compensation; lumped parameter networks; multichip modules; Marchand balun; broadband performance; compaction; lumped element compensation; lumped impedance matched type; multilayer MMIC/MCM baluns; wireless applications; Compaction; Frequency; Impedance matching; MMICs; Nonhomogeneous media; Silicon; Space technology; Strips; Voltage; Wireless communication;
Conference_Titel :
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3814-6
DOI :
10.1109/MWSYM.1997.604573
