DocumentCode
182585
Title
A potential failure reason for Spindt cathodes in high current applications
Author
Xinghui Li ; Guodong Bai ; Hanyan Li ; Mingqing Ding ; Jinjun Feng ; Fujiang Liao
Author_Institution
Nat. Key Lab. of Sci. & Technol. on Vacuum Electron., Beijing Vacuum Electron. Res. Inst., Beijing, China
fYear
2014
fDate
22-24 April 2014
Firstpage
509
Lastpage
510
Abstract
We believe one main reason for Spindt cathodes failure in initial testing is metal particle adhesion produced in cone formation process. It is also a potential failure reason in high current applications. Preliminary experiments show megahertz ultrasonic cleaning is effective in removing the particles but further work is still need.
Keywords
adhesion; failure analysis; flashover; ultrasonic cleaning; Spindt cathodes failure; cone formation process; high current applications; megahertz ultrasonic cleaning; metal particle adhesion; Acoustics; Adhesives; Cathodes; Cavity resonators; Cleaning; Logic gates; Metals; Spindt cathode; cathode failure; high current application; megahertz ultrasonic cleaning; metal particle adhesion;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference, IEEE International
Conference_Location
Monterey, CA
Type
conf
DOI
10.1109/IVEC.2014.6857713
Filename
6857713
Link To Document