Title :
DTI-based Virtual Reality System for Neurosurgery
Author :
Chun-Yi Lo ; Yi-Ping Chao ; Kun-Hsien Chou ; Wan-You Guo ; Jenn-Lung Su ; Ching-Po Lin
Author_Institution :
Chung-Yuan Christian Univ., Chungli
Abstract :
The relationship between tumor mass and peritumoral structures including peritumoral edema is important for planning surgical trajectory and crucial for diagnosis, tumor excision, and post-surgical outcome. The recent development of diffusion tensor MRI has shown its feasibility in grading tumor, monitoring therapeutic effects, and post-surgery outcome. To visualize the tumor mass and the peritumoral structure, a 3D virtual reality environment was developed. Neural tractography and peritumoral anatomy were integrated in this interaction VR system. Using a 3D controller, suitable surgical trajectory can be defined by manipulating the tumor mass, peritumoral microstructure, and brain tissues before neurosurgery. Post-surgery evaluation showed that this system was useful to design pre-surgerical plan and optimize therapeutic outcome.
Keywords :
biodiffusion; biomedical MRI; brain; cancer; neurophysiology; surgery; tumours; virtual reality; 3D controller; 3D virtual reality environment; DTI-based virtual reality system; brain tissue microstructure; brain tumor mass; diffusion tensor MRI; neural tractography; neurosurgery; peritumoral anatomy; peritumoral edema; peritumoral structures; postsurgery evaluation; presurgerical plan design; surgical trajectory planning; therapeutic effects monitoring; tumor excision; Anatomy; Magnetic resonance imaging; Neoplasms; Neurosurgery; Surgery; Tensile stress; Trajectory; Virtual reality; Visualization; Weight control; Computer Graphics; Diffusion Magnetic Resonance Imaging; Equipment Design; Equipment Failure Analysis; Image Interpretation, Computer-Assisted; Imaging, Three-Dimensional; Neurosurgical Procedures; Surgery, Computer-Assisted; User-Computer Interface;
Conference_Titel :
Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
Conference_Location :
Lyon
Print_ISBN :
978-1-4244-0787-3
DOI :
10.1109/IEMBS.2007.4352542