Title :
Bondability of copper wires on PPF leadframe
Author :
Wei, Tok Chee ; Ha, Johnny Yeung Ping
Author_Institution :
Heraeus Mater. Singapore Pte Ltd., Singapore, Singapore
Abstract :
The imposition of lead-free production for most of electrical and electronic components in the 2006 EU legislation has lead to leadframes manufacturers looking into other solderable alternatives for PCB soldering assembly. One of the alternatives is Tin (Sn) plating but it brings along other risks such as whisker growth. Nickel palladium (NiPd) based PPF (Pre-Plated Finishes) leadframe becomes another feasible option with no Sn-whisker risk. This introduction has greatly economized the cost of IC assembly by eliminating the post-mold plating process.
Keywords :
bonding processes; copper; electroplating; moulding; soldering; wires; 2006 EU legislation; IC assembly; PCB soldering assembly; PPF leadframe; bondability; copper wires; electrical components; electronic components; lead-free production; leadframe manufacturers; nickel palladium; post-mold plating process; pre-plated finishes leadframe; whisker growth; Bonding; Copper; Electronics packaging; High temperature superconductors; Lead; Wires;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184377
