Title :
Interfacial microstructure and mechanical reliability of Cu pillar/Sn-3.5Ag bump for 3D packages
Author :
Kwak, Byung-Hyun ; Jae-Myeong Kim ; Jeong, Myeong-Hyeok ; Lee, Kiwook ; Kim, Jaedong ; Park, Young-Bae
Author_Institution :
Andong Nat. Univ., Andong, South Korea
Abstract :
Interfacial microstructure and mechanical reliability of Cu pillar/Sn-3.5Ag microbumps during annealing conditions were systematically and quantitatively evaluated. The IMC growth followed a linear relationship with the square root of the annealing time, which means that the IMC growth was controlled by a diffusion mechanism. The shear strength and IMC thickness increased quadratically with annealing time at 150°C, while the amount of solder decreased. It was clearly revealed that there exist strong correlations among IMC growth kinetics, shear strength, and fracture modes in Cu/solder microbumps.
Keywords :
annealing; packaging; reliability; 3D package; IMC growth kinetics; IMC thickness; annealing conditions; annealing time; diffusion mechanism; fracture modes; interfacial microstructure; linear relationship; mechanical reliability; microbumps; shear strength; solder; square root; Annealing; Bonding; Copper; Joints; Microstructure; Reliability; Silicon;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184384
