Title :
Addressing Delamination for Fast Development of Reliable Packages
Author :
Kanert, W. ; Pufall, R.
Author_Institution :
Infineon Technol. AG, Neubiberg, Germany
Abstract :
Delamination remains a major problem for the reliability of semiconductor components. It is typically addressed with temperature cycling tests, which are rather time-consuming. The paper presents an approach to provide data for material selection in the early development phase based on adhesion measurements and simulation. The approach provides an improved base for decision and allows to reduce development times.
Keywords :
adhesion; delamination; semiconductor device packaging; semiconductor process modelling; adhesion measurements; delamination; material selection; reliable packages; semiconductor components reliability; temperature cycling tests; Adhesives; Delamination; Materials; Reliability; Stress; Temperature; Temperature measurement;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184386
