DocumentCode
1826143
Title
Addressing Delamination for Fast Development of Reliable Packages
Author
Kanert, W. ; Pufall, R.
Author_Institution
Infineon Technol. AG, Neubiberg, Germany
fYear
2011
fDate
7-9 Dec. 2011
Firstpage
59
Lastpage
62
Abstract
Delamination remains a major problem for the reliability of semiconductor components. It is typically addressed with temperature cycling tests, which are rather time-consuming. The paper presents an approach to provide data for material selection in the early development phase based on adhesion measurements and simulation. The approach provides an improved base for decision and allows to reduce development times.
Keywords
adhesion; delamination; semiconductor device packaging; semiconductor process modelling; adhesion measurements; delamination; material selection; reliable packages; semiconductor components reliability; temperature cycling tests; Adhesives; Delamination; Materials; Reliability; Stress; Temperature; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location
Singapore
Print_ISBN
978-1-4577-1983-7
Electronic_ISBN
978-1-4577-1981-3
Type
conf
DOI
10.1109/EPTC.2011.6184386
Filename
6184386
Link To Document