Sinter adhesive - new horizons in semiconductor packaging

Conductive adhesives provide advantageous properties for many electronics assembly applications (low processing temperatures, high flexibility) and they are green materials. However, the limited electrical and thermal conductivity of conventional conductive adhesives restrict their usage in most cases to low to medium power density packages. The novel mAgic silver sinter adhesives feature the conventional positive properties of conductive adhesives and combine them with electrical and thermal conductivity that are comparable to solder. This new development therefore provides solutions to the growing challenge of increasing power densities related to shrinkage of packages and / or increase of power.