Title :
Cost effective 300mm large scale eWLB (embedded Wafer Level BGA) technology
Author :
Prashant, Meenakshi ; Yoon, Seung Wook ; Lin, Yaojian ; Marimuthu, Pandi C.
Author_Institution :
STATS ChipPAC Ltd., Singapore, Singapore
Abstract :
This paper will highlight some of the recent advancements in 300mm eWLB wafer development. Compared to 200mm case, 300mm eWLB wafer has more warpage and process issues due to its area increase. Thermo-mechanical simulation shows 100~150% more warpage with 300mm eWLB wafer compared to 200mm. So various design parameters were studied to optimized warpage, such as dielectric materials and thickness, molding compound thickness etc. This paper also presents study of process optimization for 300mm eWLB and on overall warpage behavior in different process steps. Finally 300mm eWLB test vehicles are fabricated and tested in JEDEC standard test conditions. It also describes mechanical characterization, reliability data including component/board level, challenges encountered and overcome, and future steps.
Keywords :
ball grid arrays; dielectric materials; wafer level packaging; JEDEC standard test conditions; component-board level; dielectric materials; embedded wafer level BGA technology; large scale eWLB technology; molding compound thickness; size 300 mm; thermomechanical simulation; Compounds; Electronics packaging; Materials; Packaging; Reliability; Semiconductor device modeling; Three dimensional displays;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184398
