Title :
New circuit model for modeling differential pair of through-hole vias in multilayered electronic packages
Author :
Oo, Zaw Zaw ; En-Xiao Liu ; Er-Ping Li
Author_Institution :
Electron. & Photonics Dept., A*STAR, Singapore, Singapore
Abstract :
A new equivalent circuit model is presented for modeling a differential pair of through-hole vias in multilayered electronic packages. The differential pair of through-hole vias, which share same anti-pad clearance, is analyzed and an equivalent circuit model for the differential vias is analytically derived from the electro- and magneto-quasi-static relations of the E and H fields along with the intrinsic via circuit model. The proposed circuit model is numerically validated and integrated to a systematic analysis of microwave network approach for power and signal integrity simulation in multilayered electronic packages.
Keywords :
equivalent circuits; three-dimensional integrated circuits; anti-pad clearance; differential pair; differential vias; electro-quasi-static relation; equivalent circuit model; intrinsic via circuit model; magneto-quasi-static relation; microwave network; multilayered electronic package; signal integrity simulation; systematic analysis; through-hole vias; Analytical models; Equivalent circuits; Finite element methods; Integrated circuit modeling; Microwave circuits; Numerical models;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184407
