Title :
Electrical modeling, simulation and SPICE model extraction of TSVs in silicon interposer
Author :
Sun, Xin ; Zhu, Yunhui ; Ma, Shenglin ; Miao, Min ; Chen, Jing ; Jin, Yufeng
Author_Institution :
Nat. Key Lab. on Micro/Nano Fabrication Technol., Peking Univ., Beijing, China
Abstract :
In this paper, electrical characteristic of TSV (Through Silicon Via) is analyzed. Firstly, equivalent circuit model of TSV is summarized. Modeling and electrical analysis of TSV is conducted, in which TSVs with ideal and non-ideal profiles are compared. And then, multi-TSV configuration in silicon interposer is modeled and analyzed. Capacitive and inductive coupling between TSVs are simulated. With these analyses, solutions to decrease crosstalk between TSVs are proposed.
Keywords :
SPICE; equivalent circuits; integrated circuit interconnections; silicon; SPICE model extraction; capacitive coupling; electrical modeling; equivalent circuit model; inductive coupling; multi-TSV configuration; through silicon via; vinterposer; Analytical models; Couplings; Crosstalk; Integrated circuit modeling; Silicon; Three dimensional displays; Through-silicon vias;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184409
