Design simulation and fabrication of 3D electrode for dielectrophoretic chip

Author

Singha, Monoj Kumar ; Nagaraju, Jampana

Author_Institution

Instrum. & Appl. Phys. Dept., Indian Inst. of Sci., Bangalore, India

fYear

2015

fDate

7-10 March 2015

Firstpage

192

Lastpage

195

Abstract

This paper presents the design, simulation and fabrication of dielectrophoretic chip with integrated nickel 3D electrodes for bioparticle separation. Finite element analysis software COMSOL Multyphysics 4.3 is used to measure the electric field distribution and also the temperature profile inside the microfluidic channel. The temperature rise is found to be 0.5 K. Electric field distribution shows almost uniform electric field on XY plane at different Z axis. Fabrication of 3D nickel electrode is accomplished using electroplating process. 3D sidewall dielectrophoretic chip reduces the electrochemical effect and joule heating effect.

Keywords

electric field measurement; electrochemical electrodes; electrophoresis; electroplating; finite element analysis; microfluidics; 3D nickel electrode fabrication; 3D sidewall dielectrophoretic chip; COMSOL Multyphysics 4.3; Joule heating effect; bioparticle separation; electric field distribution; electrochemical effect; electroplating process; finite element analysis software; integrated nickel 3D electrodes; microfluidic channel; temperature profile; uniform electric field; Dielectrophoresis; Electric fields; Electrodes; Fabrication; Microfluidics; Nickel; Three-dimensional displays; dielectrophoretic chip; electric field distribution; electroplating; finite element analysis; sidewall nickel 3D electrode;

fLanguage

English

Publisher

ieee

Conference_Titel

Physics and Technology of Sensors (ISPTS), 2015 2nd International Symposium on

Conference_Location

Pune

Type

conf

DOI

10.1109/ISPTS.2015.7220110

Filename

7220110