Title :
Extraction of coupled SPICE models for packages and interconnects
Author :
Diamond, Scott ; Janko, Bo
Author_Institution :
Tektronix Inc., Beaverton, OR, USA
Abstract :
We have developed a method, using TDR, to extract an equivalent coupled SPICE model for a set of package pins. The technique does not use any fitting or optimization. With the appropriate fixturing this method could be used for automated model extraction. The SPICE model which is produced, models the propagation delay and crosstalk between pins
Keywords :
SPICE; crosstalk; delays; fault diagnosis; fault location; integrated circuit interconnections; integrated circuit modelling; integrated circuit testing; packaging; automated model extraction; coupled SPICE models; crosstalk; interconnects; leadless chip carrier; package pins; packages; Fixtures; Inductance; Inductors; Integrated circuit interconnections; Integrated circuit packaging; Pins; SPICE; Semiconductor device packaging; Testing; Voltage;
Conference_Titel :
Test Conference, 1993. Proceedings., International
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-1430-1
DOI :
10.1109/TEST.1993.470668
