Title :
Electromigration in electroplated gold micro contacts
Author :
Kleff, Jessica ; Engelmann, Gunter ; Oppermann, Hermann ; Reichl, Herbert
Author_Institution :
Tech. Univ. Berlin, Berlin, Germany
Abstract :
Current densities in micro contacts are increasing. Therefore electromigration as failure mechanism becomes more important. In this paper, we discuss newly developed gold micro contact structures for electromigration tests. The structure is a free standing electroplated contact without bonding interface. The process flow as well as the experimental setup are described in detail. These novel structures are compared to so called dogbone structures. A simple model is derived to describe the void growth in the bump and the resistance curve. The model and the experimental results are compared.
Keywords :
electrical contacts; electromigration; electroplated coatings; failure analysis; solders; voids (solid); Au; bump; electromigration tests; electroplated gold microcontacts; failure mechanism; free standing electroplated contact; process flow; resistance curve; void growth; Conductors; Current density; Electromigration; Gold; Ovens; Resistance; Temperature measurement;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184431
