• DocumentCode
    182737
  • Title

    Micromachined silicon channels for THz interconnect

  • Author

    Bo Yu ; Yuhao Liu ; Xing Hu ; Xiaoxin Ren ; Xiaoguang Liu ; Gu, Qun Jane

  • Author_Institution
    Electr. & Comput. Eng. Dept., Univ. of California Davis, Davis, CA, USA
  • fYear
    2014
  • fDate
    6-6 June 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper, for the first time, presents planar silicon process compatible interconnect channels, which can be extended to THz frequencies for high performance interconnect systems to fill the long-standing intra-/inter- chip interconnect gap.
  • Keywords
    elemental semiconductors; integrated circuit interconnections; millimetre wave integrated circuits; silicon; terahertz wave devices; Si; THz interconnect; high performance interconnect systems; interconnect channels; long-standing interchip interconnect gap; long-standing intrachip interconnect gap; micromachined silicon channels; planar silicon process; Coplanar waveguides; Couplers; Fabrication; Patch antennas; Silicon; Substrates; Channel; THz; dielectric waveguide; interconnect; micro-machined;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless and Microwave Technology Conference (WAMICON), 2014 IEEE 15th Annual
  • Conference_Location
    Tampa, FL
  • Type

    conf

  • DOI
    10.1109/WAMICON.2014.6857799
  • Filename
    6857799
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=182737