Title :
Micromachined silicon channels for THz interconnect
Author :
Bo Yu ; Yuhao Liu ; Xing Hu ; Xiaoxin Ren ; Xiaoguang Liu ; Gu, Qun Jane
Author_Institution :
Electr. & Comput. Eng. Dept., Univ. of California Davis, Davis, CA, USA
Abstract :
This paper, for the first time, presents planar silicon process compatible interconnect channels, which can be extended to THz frequencies for high performance interconnect systems to fill the long-standing intra-/inter- chip interconnect gap.
Keywords :
elemental semiconductors; integrated circuit interconnections; millimetre wave integrated circuits; silicon; terahertz wave devices; Si; THz interconnect; high performance interconnect systems; interconnect channels; long-standing interchip interconnect gap; long-standing intrachip interconnect gap; micromachined silicon channels; planar silicon process; Coplanar waveguides; Couplers; Fabrication; Patch antennas; Silicon; Substrates; Channel; THz; dielectric waveguide; interconnect; micro-machined;
Conference_Titel :
Wireless and Microwave Technology Conference (WAMICON), 2014 IEEE 15th Annual
Conference_Location :
Tampa, FL
DOI :
10.1109/WAMICON.2014.6857799
