Embedded Wafer Level BGA (eWLB) - extra-small and eLGA packages

Author

Anandan, Ramasamy ; Huang, Yaohuang ; Jin, Yonggang ; Gan, Kah Wee ; Chua, Puay Gek ; Liu, Yun ; Alvin, Jose Caparas

Author_Institution

STMicroelectron., Singapore, Singapore

fYear

2011

fDate

7-9 Dec. 2011

Firstpage

412

Lastpage

416

Abstract

This paper discusses two types of eWLB packages. One is extra-small package and second is Embedded Land Grid Array (eLGA) package. Although single die eWLB has been around for quite some time, processing of very small dies and packages can pose many challenges. In extra-small eWLB package, a single die is placed with a small gap from the package edge, encapsulated by mold compound and interconnected with redistributed layers (RDL) and solder balls. eLGA is a thinner package compared to conventional LGAs. The objective of this paper is to share test vehicle designs, challenges in processing, potential solutions, key processes, package level and board level reliability tests.

Keywords

integrated circuit reliability; solders; wafer level packaging; RDL; board level reliability tests; eLGA package; eWLB packages; embedded land grid array package; embedded wafer level BGA; extra-small package; key processes; mold compound; package edge; package level; redistributed layers; solder balls; test vehicle designs; Compounds; Electronics packaging; Image edge detection; Reliability; Silicon; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th

Conference_Location

Singapore

Print_ISBN

978-1-4577-1983-7

Electronic_ISBN

978-1-4577-1981-3

Type

conf

DOI

10.1109/EPTC.2011.6184456

Filename

6184456