Title :
Embedded Wafer Level BGA (eWLB) - extra-small and eLGA packages
Author :
Anandan, Ramasamy ; Huang, Yaohuang ; Jin, Yonggang ; Gan, Kah Wee ; Chua, Puay Gek ; Liu, Yun ; Alvin, Jose Caparas
Author_Institution :
STMicroelectron., Singapore, Singapore
Abstract :
This paper discusses two types of eWLB packages. One is extra-small package and second is Embedded Land Grid Array (eLGA) package. Although single die eWLB has been around for quite some time, processing of very small dies and packages can pose many challenges. In extra-small eWLB package, a single die is placed with a small gap from the package edge, encapsulated by mold compound and interconnected with redistributed layers (RDL) and solder balls. eLGA is a thinner package compared to conventional LGAs. The objective of this paper is to share test vehicle designs, challenges in processing, potential solutions, key processes, package level and board level reliability tests.
Keywords :
integrated circuit reliability; solders; wafer level packaging; RDL; board level reliability tests; eLGA package; eWLB packages; embedded land grid array package; embedded wafer level BGA; extra-small package; key processes; mold compound; package edge; package level; redistributed layers; solder balls; test vehicle designs; Compounds; Electronics packaging; Image edge detection; Reliability; Silicon; Vehicles;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184456
