Title :
FE-simulation of inductively excited lock-in thermography for electronic interconnections
Author :
Bohm, J. ; Wolter, K.-J.
Author_Institution :
Electron. Packaging Lab. (IAVT), Tech. Univ. Dresden, Dresden, Germany
Abstract :
In this paper the non-destructive evaluation method of inductively excited thermography (InduLIT) is investigated utilizing a FE-model. The whole process of InduLIT is simulated. The model is designed as a framework for the fast optimization of the excitation geometry and electrical parameters depending on the sample type. A first embodiment with a novel flexible grid shaped coil and TSVs as samples is presented. For this coil-sample-combination different excitation parameters are optimized. Experimental results of InduLIT on PCB vias match with the simulation in principle.
Keywords :
coils; excited states; finite element analysis; infrared imaging; integrated circuit interconnections; optimisation; printed circuits; three-dimensional integrated circuits; FE simulation; InduLIT; PCB; TSV; electrical parameters; electronic interconnections; excitation geometry; flexible grid shaped coil; inductively excited lock-in thermography; optimization; Coils; Geometry; Heating; Silicon; Solid modeling; Through-silicon vias;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184461
