DocumentCode
1828296
Title
System level interconnect test in a tristate environment
Author
Angelotti, Frank W. ; Britson, Wayne A. ; Kaliszewski, Kerry T. ; Douskey, Steve M.
Author_Institution
IBM Application Bus. Syst. Div., Rochester, MN, USA
fYear
1993
fDate
17-21 Oct 1993
Firstpage
45
Lastpage
53
Abstract
System interconnect test is a significant challenge. In this paper we describe a practical system level interconnect test scheme which has been successfully implemented in a commercial environment. This test scheme is responsible for uncovering faults in driver/receiver elements, card level interconnects and backplane interconnects. It is used both as a manufacturing test and in field service. We point out the unique problems which must be addressed to carry out interconnect test at the system level and present our solutions. Our approach involves generating interconnect test data in the system at test time with knowledge of the current system configuration and individual component (card level) netlists. Interconnect tests that represent a good compromise between efficiency and diagnostic capability at the system level are presented and analyzed in detail
Keywords
automatic testing; boundary scan testing; fault diagnosis; fault location; printed circuit accessories; printed circuit testing; printed circuits; production testing; backplane interconnects; boundary scan technology; card level interconnects; diagnostic capability; driver/receiver; efficiency; fault driver; field service; interconnect test data; manufacturing test; mask generation; shorted wet testing; tristate environment; Backplanes; Business; Digital systems; Electronic equipment testing; Fault diagnosis; Latches; Logic testing; Manufacturing; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1993. Proceedings., International
Conference_Location
Baltimore, MD
Print_ISBN
0-7803-1430-1
Type
conf
DOI
10.1109/TEST.1993.470719
Filename
470719
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