• DocumentCode
    1828296
  • Title

    System level interconnect test in a tristate environment

  • Author

    Angelotti, Frank W. ; Britson, Wayne A. ; Kaliszewski, Kerry T. ; Douskey, Steve M.

  • Author_Institution
    IBM Application Bus. Syst. Div., Rochester, MN, USA
  • fYear
    1993
  • fDate
    17-21 Oct 1993
  • Firstpage
    45
  • Lastpage
    53
  • Abstract
    System interconnect test is a significant challenge. In this paper we describe a practical system level interconnect test scheme which has been successfully implemented in a commercial environment. This test scheme is responsible for uncovering faults in driver/receiver elements, card level interconnects and backplane interconnects. It is used both as a manufacturing test and in field service. We point out the unique problems which must be addressed to carry out interconnect test at the system level and present our solutions. Our approach involves generating interconnect test data in the system at test time with knowledge of the current system configuration and individual component (card level) netlists. Interconnect tests that represent a good compromise between efficiency and diagnostic capability at the system level are presented and analyzed in detail
  • Keywords
    automatic testing; boundary scan testing; fault diagnosis; fault location; printed circuit accessories; printed circuit testing; printed circuits; production testing; backplane interconnects; boundary scan technology; card level interconnects; diagnostic capability; driver/receiver; efficiency; fault driver; field service; interconnect test data; manufacturing test; mask generation; shorted wet testing; tristate environment; Backplanes; Business; Digital systems; Electronic equipment testing; Fault diagnosis; Latches; Logic testing; Manufacturing; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1993. Proceedings., International
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    0-7803-1430-1
  • Type

    conf

  • DOI
    10.1109/TEST.1993.470719
  • Filename
    470719