Title :
To inhibit the consumption of Cu during multiple reflows of Pb-free on Cu
Author :
Hu, Chih-Chia ; Hsiao, Hsiang-yao ; Guo, Ming-Yung ; Chen, Chih ; Tu, K.N.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
We report an effective approach to inhibit the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu. By depositing a very thin layer of the solder on Cu and followed by a 10-min reflow, the scallop-type morphology of the interfacial Cu6Sn5 intermetallic compounds (IMCs) became flat and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMCs was retarded.
Keywords :
copper alloys; electronics packaging; metallisation; reflow soldering; silver alloys; tin alloys; Sn-Ag-Cu; copper consumption; during multiple reflow; interfacial intermetallic compounds; lead-free solder; scallop type morphology; Copper; Electronics packaging; Intermetallic; Materials; Morphology; Scanning electron microscopy; Soldering;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184472
