DocumentCode :
1828479
Title :
A simplified approach to simulate bubble nucleation in flow boiling
Author :
Xing, X.Q. ; Lee, Y.J. ; Hoe, Y.Y. ; Zhang, X. ; Gao, S. ; Pinjala, D.
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
fYear :
2011
fDate :
7-9 Dec. 2011
Firstpage :
525
Lastpage :
529
Abstract :
A simplified numerical methodology is proposed to simulate bubble nucleation for flow boiling heat transfer in the microchannels heat sink. Flow boiling characteristics such as bubble departure frequency, bubble grow time, waiting time, and nucleation site density, as well as bubble departure diameter are modeled using empirical theoretical correlations for the bubble nucleation simulation in the microchannel. The volume of fluid (VOF) method is used to simulate two phase flow and also to track bubbles motion in the microchannels. Energy equation is included to analyze the heat transfer of flow boiling. Effect of channel dimensions and mass flow rates to the flow boiling is also examined in this study. Simulation results indicate that the heat dissipation capability of the heat sink can be significantly enhanced by the flow boiling in microchannel. Smaller channel height and higher coolant flow rate also demonstrate better heat dissipation capability.
Keywords :
bubbles; cooling; flow simulation; microchannel flow; nucleation; two-phase flow; bubble departure diameter; bubble departure frequency; bubble grow time; bubble nucleation; bubbles motion; channel dimensions; channel height; coolant flow rate; empirical theoretical correlations; energy equation; flow boiling; heat dissipation capability; heat transfer; mass flow rates; microchannels heat sink; nucleation site density; numerical methodology; two phase flow; volume of fluid method; waiting time; Coolants; Correlation; Heat sinks; Heat transfer; Heating; Mathematical model; Microchannel;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
Type :
conf
DOI :
10.1109/EPTC.2011.6184477
Filename :
6184477
Link To Document :
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