• DocumentCode
    1828479
  • Title

    A simplified approach to simulate bubble nucleation in flow boiling

  • Author

    Xing, X.Q. ; Lee, Y.J. ; Hoe, Y.Y. ; Zhang, X. ; Gao, S. ; Pinjala, D.

  • Author_Institution
    Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
  • fYear
    2011
  • fDate
    7-9 Dec. 2011
  • Firstpage
    525
  • Lastpage
    529
  • Abstract
    A simplified numerical methodology is proposed to simulate bubble nucleation for flow boiling heat transfer in the microchannels heat sink. Flow boiling characteristics such as bubble departure frequency, bubble grow time, waiting time, and nucleation site density, as well as bubble departure diameter are modeled using empirical theoretical correlations for the bubble nucleation simulation in the microchannel. The volume of fluid (VOF) method is used to simulate two phase flow and also to track bubbles motion in the microchannels. Energy equation is included to analyze the heat transfer of flow boiling. Effect of channel dimensions and mass flow rates to the flow boiling is also examined in this study. Simulation results indicate that the heat dissipation capability of the heat sink can be significantly enhanced by the flow boiling in microchannel. Smaller channel height and higher coolant flow rate also demonstrate better heat dissipation capability.
  • Keywords
    bubbles; cooling; flow simulation; microchannel flow; nucleation; two-phase flow; bubble departure diameter; bubble departure frequency; bubble grow time; bubble nucleation; bubbles motion; channel dimensions; channel height; coolant flow rate; empirical theoretical correlations; energy equation; flow boiling; heat dissipation capability; heat transfer; mass flow rates; microchannels heat sink; nucleation site density; numerical methodology; two phase flow; volume of fluid method; waiting time; Coolants; Correlation; Heat sinks; Heat transfer; Heating; Mathematical model; Microchannel;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4577-1983-7
  • Electronic_ISBN
    978-1-4577-1981-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2011.6184477
  • Filename
    6184477