Title :
Ku-band MMIC´s in low-cost, SMT compatible packages
Author :
Huang, H.C. ; Ezzeddine, A. ; Darwish, Ali ; Hsu, B. ; Williams, J. ; Peak, S.
Author_Institution :
AMCOM Commun. Inc., Clarksburg, MD, USA
Abstract :
MM-wave components are very expensive due to the high package and assembly cost. This paper describes a 0.25 /spl mu/m PHEMT Ku-band 2-watt PA, and a 2.2 dB NF LNA MMIC in a low-cost SMT package ($2.00). The package has excellent thermal resistance, 0.5 C/W, return loss (20 dB), and input/output isolation (40 dB), from DC-40 GHz. We believe this is the first time such a package design has been published.
Keywords :
HEMT integrated circuits; MIMIC; MMIC amplifiers; MMIC power amplifiers; field effect MMIC; integrated circuit packaging; surface mount technology; 0 to 40 GHz; 0.25 micron; 2.2 dB; 20 dB; Ku-band MMICs; MM-wave packages; PHEMT LNA; PHEMT MMIC; PHEMT power amplifier; SMT compatible packages; input/output isolation; low-cost packages; low-noise amplifier; package design; package thermal resistance; return loss; Assembly; Bonding; Ceramics; Costs; MMICs; Millimeter wave technology; Packaging; Radio frequency; Surface-mount technology; Thermal resistance;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1011550
