Title :
High speed full wafer monitoring of surface, edge and bonding interface for 3Dstacking
Author :
Guittet, Pierre-Yves ; Markwort, Lars ; Savage, Greg ; Kappel, Christoph ; Halder, Sandip ; Phommahaxay, Alain ; Jourdain, Anne ; Miller, Andy
Author_Institution :
Nanda Tech Gmbh, Unterschleissheim, Germany
Abstract :
3D integration requires innovative process control solutions to ensure the integrity of the device wafers that are bonded, thinned and then de-bonded before permanent bonding. Right now, most 3D-TSV pilot lines use a number of semi-auto or manual inspection tools: Microscopes, interferometers, profilometers and acoustic microscopes. Other sites use automated scanning inspection tools that are not adapted to detect specific 3D integration defectivity. Leading the field, IMEC and Nanda Tech partnered to tailor the Spark platform to the requirements of 3D integration process control. From the pilot line to the high volume manufacturing fabs, Spark provides a flexible process control platform, adapted to handling bonded wafers and finding the defects of interest that will affect expensive customer wafers.
Keywords :
inspection; integrated circuit bonding; process control; three-dimensional integrated circuits; 3D integration process control; 3D stacking; 3D-TSV pilot lines; bonded wafer; bonding interface; device wafer; edge monitoring; high speed full wafer monitoring; permanent bonding; surface monitoring; Bonding; Inspection; Metrology; Process control; Silicon; Sparks; Three dimensional displays;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184492