DocumentCode

1828826

Title

Investigation on Mechanism of Creep Corrosion of Immersion Silver Finished Printed Circuit Board by Clay Tests

Author

Zhou, Yilin ; Pecht, Michael

fYear

2009

fDate

14-16 Sept. 2009

Firstpage

324

Lastpage

333

Keywords

Circuit testing; Corrosion; Creep; Distributed computing; Polynomials; Printed circuits; Production systems; Robotics and automation; Silver; Throughput;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Contacts, 2009 Proceedings of the 55th IEEE Holm Conference on

Conference_Location

Vancouver, British Columbia, Canada

Print_ISBN

978-1-4244-3613-2

Electronic_ISBN

978-1-4244-3613-2

Type

conf

DOI

10.1109/HOLM.2009.5284380

Filename

5284380