Title :
Investigation on Mechanism of Creep Corrosion of Immersion Silver Finished Printed Circuit Board by Clay Tests
Author :
Zhou, Yilin ; Pecht, Michael
Keywords :
Circuit testing; Corrosion; Creep; Distributed computing; Polynomials; Printed circuits; Production systems; Robotics and automation; Silver; Throughput;
Conference_Titel :
Electrical Contacts, 2009 Proceedings of the 55th IEEE Holm Conference on
Conference_Location :
Vancouver, British Columbia, Canada
Print_ISBN :
978-1-4244-3613-2
Electronic_ISBN :
978-1-4244-3613-2
DOI :
10.1109/HOLM.2009.5284380
