• DocumentCode
    1828978
  • Title

    Numerical simulations of forced convection in novel cylindrical oblique-finned heat sink

  • Author

    Fan, Yan ; Lee, Poh Seng ; Jin, Liwen ; Chua, Beng Wah

  • fYear
    2011
  • fDate
    7-9 Dec. 2011
  • Firstpage
    647
  • Lastpage
    652
  • Abstract
    In this paper, forced convection heat transfer of laminar flow through novel cylindrical discrete oblique fin heat sinks were simulated by Computational Fluid Dynamics method (CFD). The single channel structure was imported into FLUENT v.12.1 as a physical model to be simulated. The various aspect ratio and length ratios of discrete oblique fin arrays were investigated, and the optimized results were achieved. According to the results, the average Nusselt number for the copper heat sink could increase by as much as 73.5% and the average convective thermal resistance for the novel cylindrical micro-channel reduces by as much as 61.7% in comparison with the conventional micro-channel. The wall temperature and temperature gradient of cylindrical oblique fin heat sink are also much lower than those of conventional straight fin heat sink. It was concluded that the novel cylindrical microchannel heat sink is superior to conventional cylindrical microchannel heat sink. Lastly, the guidelines for optimizing cylindrical heat sink structure in different applications were also discussed.
  • Keywords
    computational fluid dynamics; flow simulation; forced convection; heat sinks; laminar flow; microchannel flow; thermal resistance; CFD; FLUENT v.12.1; Nusselt number; computational fluid dynamics; convective thermal resistance; cylindrical discrete oblique-finned heat sink; cylindrical microchannel heat sink; forced convection heat transfer; laminar flow; numerical simulations; temperature gradient; wall temperature; Fluids; Heat pumps; Heat sinks; Heat transfer; Mathematical model; Microchannel; Thermal resistance; Nusselt number; cylindrical heat sink; forced convection; oblique fin; thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4577-1983-7
  • Electronic_ISBN
    978-1-4577-1981-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2011.6184499
  • Filename
    6184499