Title :
Submerged liquid jet impingement cooling
Author :
Wang, Z.Y. ; Wong, T.N. ; Duan, F. ; Toh, K.C. ; Choo, K.F. ; Tan, S.P. ; Loh, C.V. ; Yeo, S.C.
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
In this paper, submerged liquid jet array impingement is proposed as a solution for the thermal management of the high performance electronics. Experiments were done using a submerged jet array of 285 nozzles of 0.5 mm diameter spaced 5.5 mm apart, machined on a 5 mm thick nozzle plate, with an impingement height of 3 mm. The temperature difference between the average heat source temperature and the inlet temperature decreases with the flow rate and increases with the heating power. The experimental Nusselt numbers agree well with the reported data in previous studies. Numerical studies were also conducted on a selected 16-nozzle module using the renormalization group (RNG) k-ε turbulence model. The temperature and velocity fields were obtained, and the average heat transfer coefficients from the numerical studies show good agreement with the experimental results.
Keywords :
cooling; jets; nozzles; numerical analysis; renormalisation; thermal management (packaging); turbulence; 16-nozzle module; Nusselt numbers; RNG k-ε turbulence model; flow rate; heat source temperature; heat transfer coefficients; heating power; high performance electronics; inlet temperature; renormalization group k-ε turbulence model; size 0.5 mm; submerged liquid jet array impingement cooling; temperature fields; thermal management; velocity fields; Arrays; Cooling; Heat transfer; Numerical models; Resistance heating; Temperature measurement;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184501
