Simultaneous microchannel formation and copper deposition on silicon along with surface treatment

A process for simultaneous surface treatment, micromachining and copper deposition on silicon wafer is reported here. The process addresses three issues viz. surface treatment, micromachining to form microchannels and subsequent copper deposition into this microchannel on silicon surface simultaneously. The suggested process is based on the electrochemical spark phenomenon. At a time, in its conventional form it is used either for machining or for the deposition purposes. With the use of an alternating voltage (AC) supply, all the three phenomena are achieved simultaneously. Microchannels with copper deposition in them are characterized using scanning electron microscope (SEM), and elemental diffraction analysis using x rays (EDAX).