DocumentCode
1829194
Title
2011 IEEE 13th Electronics Packaging Technology Conference [front matter]
fYear
2011
fDate
7-9 Dec. 2011
Firstpage
1
Lastpage
20
Abstract
The following topics are dealt with: advanced packaging; electrical modeling & signal integrity; interconnection technologies; materials & processes; mechanical modeling & structural integrity; printed electronics; quality & reliability; thermal characterization & cooling solutions; wafer/package and IC testing.
Keywords
cooling; electronics packaging; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; quality control; wafer level packaging; IC testing; advanced packaging; cooling solutions; electrical modeling; electronics packaging; interconnection technology; materials & processes; mechanical modeling; printed electronics; quality & reliability; signal integrity; structural integrity; thermal characterization; wafer-package;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location
Singapore
Print_ISBN
978-1-4577-1983-7
Electronic_ISBN
978-1-4577-1981-3
Type
conf
DOI
10.1109/EPTC.2011.6184506
Filename
6184506
Link To Document