Optoelectronic package having optical waveguide hole and 4-ch × 10-Gb/s chip-to-chip interconnection using thin-film waveguide connector

Author

Takagi, Yutaka ; Suzuki, Atsushi ; Horio, Toshikazu ; Ohno, Takeshi ; Kojima, Toshifumi ; Takada, Toshikatsu ; Iio, Satoshi ; Obayashi, Kazushige ; Okuyama, Masahiko

Author_Institution

R&D Center, NGK Spark Plug Co., Ltd., Komaki

fYear

2009

fDate

22-26 March 2009

Firstpage

1

Lastpage

3

Abstract

We have developed optoelectronic packages having optical waveguide holes with core-clad structure for chip-to-chip interconnection within computer systems. 4-channels times 10 Gb/s signal transmissions between packages were demonstrated with thin-film polymer waveguide.

Keywords

chip-on-board packaging; optical interconnections; optical polymers; optical waveguides; bit rate 10 Gbit/s; bit rate 40 Gbit/s; chip-to-chip interconnection; core-clad structure; optical waveguide hole; optoelectronic package; polymer waveguide; thin-film waveguide connector; Connectors; Electromagnetic waveguides; High speed optical techniques; Optical crosstalk; Optical devices; Optical films; Optical interconnections; Optical signal processing; Optical waveguides; Packaging; (130.5460) Polymer waveguides; (200.4650) Optical Interconnects;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical Fiber Communication - incudes post deadline papers, 2009. OFC 2009. Conference on

Conference_Location

San Diego, CA

Print_ISBN

978-1-4244-2606-5

Electronic_ISBN

978-1-55752-865-0

Type

conf

Filename

5032822