Title :
Non-destructive inspection of through mould vias in stacked embedded packages by micro-CT
Author :
Roth, Holger ; Neubrand, Tobias
Author_Institution :
Applic. Lab. Stuttgart, GE Sensing & Inspection Technol. GmbH, Stuttgart, Germany
Abstract :
Through mould vias (TMV) for stacking of mould embedded packages recently presented by Braun et al. were inspected by novel microfocus computed tomography at micron resolution as an example for interconnections in 3D integrated packages. The coating of the laser drilled TMV could be visualised as well as fill grains in the moulding compound. Further, μVias and BGA solder joints were imaged in the same scans reproducing our preliminary tests described recently on a higher level of integration.
Keywords :
ball grid arrays; computerised tomography; integrated circuit packaging; moulding; stacking; three-dimensional integrated circuits; 3D integrated package; BGA solder joint; laser drilled TMV coating; micro-CT; microfocus computed tomography; mould embedded package stacking; moulding compound; nondestructive inspection; stacked embedded package; through mould vias; Computed tomography; Electron tubes; Electronics packaging; Image resolution; Inspection; Three dimensional displays; X-ray imaging;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184511
