Non-destructive inspection of through mould vias in stacked embedded packages by micro-CT

Author

Roth, Holger ; Neubrand, Tobias

Author_Institution

Applic. Lab. Stuttgart, GE Sensing & Inspection Technol. GmbH, Stuttgart, Germany

fYear

2011

fDate

7-9 Dec. 2011

Firstpage

710

Lastpage

713

Abstract

Through mould vias (TMV) for stacking of mould embedded packages recently presented by Braun et al. were inspected by novel microfocus computed tomography at micron resolution as an example for interconnections in 3D integrated packages. The coating of the laser drilled TMV could be visualised as well as fill grains in the moulding compound. Further, μVias and BGA solder joints were imaged in the same scans reproducing our preliminary tests described recently on a higher level of integration.

Keywords

ball grid arrays; computerised tomography; integrated circuit packaging; moulding; stacking; three-dimensional integrated circuits; 3D integrated package; BGA solder joint; laser drilled TMV coating; micro-CT; microfocus computed tomography; mould embedded package stacking; moulding compound; nondestructive inspection; stacked embedded package; through mould vias; Computed tomography; Electron tubes; Electronics packaging; Image resolution; Inspection; Three dimensional displays; X-ray imaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th

Conference_Location

Singapore

Print_ISBN

978-1-4577-1983-7

Electronic_ISBN

978-1-4577-1981-3

Type

conf

DOI

10.1109/EPTC.2011.6184511

Filename

6184511