DocumentCode
1829345
Title
A fully differential CMOS capacitance sensor design, testing and array architecture
Author
Prakash, Somashekar Bangalore ; Abshire, Pamela
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD
fYear
2008
fDate
18-21 May 2008
Firstpage
165
Lastpage
168
Abstract
The paper presents a fully differential capacitance sensor employing the CBCM technique to map differential input capacitances to rail-to-rail differential output voltages. The circuit has been designed for measuring capacitances in the plusmn20 fF range, appropriate for sensing live cells using on-chip microelectrodes. The paper also proposes an array architecture based on a shielded current routing bus that allows for a single measurement circuit to be shared by all the sensor pixels without compromising performance. This eliminates the need for individual pixel calibration. Each sensor pixel comprises 6 minimum size digital transistors, enabling high density integration. The sensor employs a 3-phase clocking scheme that enables gain tuning and also limits output voltage offsets. The paper presents data obtained from 5 chips fabricated in a commercially available 2- poly, 3-metal, 0.5 mum CMOS technology, each of them comprising individual circuits measuring the substrate-coupling capacitances of metal3 electrodes of varying sizes. The test data indicates successful sensor operation with a maximum sensitivity of 126 mV/fF, a maximum achievable resolution of 14 aF and an output dynamic range of 69.4 dB.
Keywords
CMOS integrated circuits; capacitive sensors; microelectrodes; 3-phase clocking scheme; CMOS capacitance sensor; array architecture; on-chip microelectrodes; shielded current routing bus; size 0.5 micron; CMOS technology; Capacitance measurement; Capacitive sensors; Circuit testing; Integrated circuit measurements; Microelectrodes; Rail to rail inputs; Rail to rail outputs; Sensor arrays; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2008. ISCAS 2008. IEEE International Symposium on
Conference_Location
Seattle, WA
Print_ISBN
978-1-4244-1683-7
Electronic_ISBN
978-1-4244-1684-4
Type
conf
DOI
10.1109/ISCAS.2008.4541380
Filename
4541380
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