Title :
Study of Thin Underlayers to Hinder Contact Resistance Increase Due to Intermetallic Compound Formation
Author :
Noël, S. ; Alamarguy, D. ; Correia, S. ; Gendre, P.
Keywords :
Aging; Chemical compounds; Coatings; Cobalt; Connectors; Contact resistance; Copper; Intermetallic; Nickel; Tin;
Conference_Titel :
Electrical Contacts, 2009 Proceedings of the 55th IEEE Holm Conference on
Conference_Location :
Vancouver, British Columbia, Canada
Print_ISBN :
978-1-4244-3613-2
Electronic_ISBN :
978-1-4244-3613-2
DOI :
10.1109/HOLM.2009.5284409
