Title :
Development of through glass tungsten via interconnect for 3D MEMS packaging
Author :
Sun, Yu ; Yu, Daquan ; Yang, Shuangshou ; Sun, Xiaofeng ; Zhang, Jing ; Wei, Xiuzhen ; Wan, Lixi
Author_Institution :
Inst. of Microelectron., Beijing, China
Abstract :
As the development of electronic devices, three-dimensional (3D) integration is the next generation of electrical packaging technique. Glass is another excellent material for packaging with lots of advantages. In this paper, we introduce novel tungsten filled through glass via wafer, simulated electronic characters and its application on MEMS.
Keywords :
electronics packaging; glass; interconnections; micromechanical devices; semiconductor device manufacture; tungsten; 3D MEMS packaging; W; electrical packaging technique; electronic devices; glass; interconnect; three-dimensional integration; Glass; Micromechanical devices; Packaging; Radio frequency; Scanning electron microscopy; Silicon; Tungsten;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184531
