Title :
Advanced VRM Incorporated with 3D DCB Package for Computor Power Management Applications
Author :
Fu, Xiao ; Jin, M.
Author_Institution :
Chongqing Univ. of Posts & Telecommun., Chongqing, China
Abstract :
This paper proposed a voltage regulator module (VRM) integrated with 3D Direct Copper Bonded (DCB) packaging technology for advanced computation applications. Technical analysis has been undertaken to investigate the multifaceted features of existing technologies in a computer system. Addressing on the technology challenges, i.e. parasitic effect and overheating issues, a 3D DCB packaged VRM is developed in this work. Its configuration is designated to improve the effectiveness in mitigating both issues, and the results are subsequently evaluated by multiphysics simulation. The results show the internal parasitic inductance of VRM has been reduced to 0.19nH in contrast to the 10nH of conventional approaches, and the 3D package leads to improved cooling efficiency for computer power management applications.
Keywords :
cooling; integrated circuit bonding; integrated circuit packaging; power aware computing; voltage regulators; 3D DCB package; 3D direct copper bonded packaging technology; VRM; advanced computation applications; computer power management applications; cooling efficiency; internal parasitic inductance; multiphysics simulation; overheating issues; parasitic effect; technical analysis; voltage regulator module; Computers; Copper; Electronic packaging thermal management; Heating; Inductance; Integrated circuit interconnections; Switches; 3D package; VRM; computer power management; multiphysics simulation;
Conference_Titel :
High Performance Computing and Communication & 2012 IEEE 9th International Conference on Embedded Software and Systems (HPCC-ICESS), 2012 IEEE 14th International Conference on
Conference_Location :
Liverpool
Print_ISBN :
978-1-4673-2164-8
DOI :
10.1109/HPCC.2012.164
