• DocumentCode
    1829975
  • Title

    Extraction of transceiver die pin capacitance using S-parameter de-embedding technique with distributed circuit modeling

  • Author

    Chyuan, Lai Lip ; Ngik, Low Hoon ; Shi, Hong

  • Author_Institution
    Altera Corp. (M) Sdn Bhd, Medan Bayan Lepas, Malaysia
  • fYear
    2011
  • fDate
    7-9 Dec. 2011
  • Firstpage
    798
  • Lastpage
    801
  • Abstract
    This paper discusses the characterization of bare die transceivers capacitance using return loss measurement from Vector Network Analyzer. The die transceivers capacitance is extracted from the return loss measurement using de-embedding techniques with distributed circuit modeling. An equivalent distributed circuit of the transceiver was modeled and the simulation results of the model were compared with the extracted measurement results. The die pin capacitance was then extracted based on measurements and simulated results.
  • Keywords
    S-parameters; capacitance; equivalent circuits; integrated circuit modelling; transceivers; S-parameter deembedding technique; bare die transceivers capacitance characterization; distributed circuit modeling; equivalent distributed circuit; return loss measurement; transceiver die pin capacitance extraction; vector network analyzer; Capacitance; Integrated circuit modeling; Loss measurement; Semiconductor device measurement; Transceivers; Transmission line measurements; Transmitters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4577-1983-7
  • Electronic_ISBN
    978-1-4577-1981-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2011.6184537
  • Filename
    6184537