A peripheral switchable 3D stacked CMOS image sensor

Author

Liu, Charles Chih-Min ; Chin-Hao Chang ; Hon-Yih Tu ; Chao, Calvin Yi-Ping ; Fu-Lung Hsueh ; Szu-Ying Chen ; Hsu, V. ; Jen-Cheng Liu ; Dun-Nien Yaung ; Shou-Gwo Wuu

Author_Institution

Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan

fYear

2014

fDate

10-13 June 2014

Firstpage

1

Lastpage

2

Abstract

A 1.1 um pitch pixel array fabricated by 45 nm 3D stacked technology, can be switched to peripheral circuits on same wafer or to other stacked wafer for process and signal integrity verification. It supports through silicon connection or direct connection to increase the flexibility by separating pixel array and sensing circuit. The novel wide operation range VCO and low power serializer are implemented to reduce the total power and noise.

Keywords

CMOS image sensors; low-power electronics; voltage-controlled oscillators; 3D stacked technology; direct connection; low power serializer; peripheral circuits; peripheral switchable 3D stacked CMOS image sensor; pitch pixel array; process verification; sensing circuit; signal integrity verification; silicon connection; size 45 nm; stacked wafer; wide operation range VCO; Abstracts; Arrays; CMOS integrated circuits; Heating; Inverters; Phase frequency detector; System-on-chip;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Circuits Digest of Technical Papers, 2014 Symposium on

Conference_Location

Honolulu, HI

Print_ISBN

978-1-4799-3327-3

Type

conf

DOI

10.1109/VLSIC.2014.6858370

Filename

6858370