1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)

fYear

1998

fDate

25-28 May 1998

Abstract

The following topics were dealt with: connectors; thermal/mechanical modelling; flip-chip underfill; PWB materials; optoelectronic modules; passive components; joining processes; flip-chip interconnections; aerospace fibre-optic components; flip-chip bumping; chip level processing; CSP; optical microbench; electrical modelling; education needs; BGA; reliability testing; parallel optoelectronics; soldering; multichip technologies; plastic packages; polymer fibres; and adhesive interconnects

Keywords

adhesion; electric connectors; electronic engineering education; flip-chip devices; joining processes; modelling; optical fibres; optoelectronic devices; packaging; printed circuits; reliability; soldering; BGA; CSP; PWB materials; adhesive interconnects; aerospace fibre-optic components; chip level processing; connectors; education needs; electrical modelling; flip-chip bumping; flip-chip interconnections; flip-chip underfill; joining processes; multichip technologies; optical microbench; optoelectronic modules; parallel optoelectronics; passive components; plastic packages; polymer fibres; reliability testing; soldering; thermal/mechanical modelling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA, USA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678663

Filename

678663