Title :
A low power and ultra high reliability LDPC error correction engine with Digital Signal Processing for embedded NAND Flash Controller in 40nm COMS
Author :
Wei Lin ; Shao-Wei Yen ; Yu-Cheng Hsu ; Yu-Hsiang Lin ; Li-Chun Liang ; Tien-Ching Wang ; Pei-Yu Shih ; Kuo-Hsin Lai ; Kuo-Yi Cheng ; Chun-Yen Chang
Author_Institution :
Phison Electron. Corp., Miaoli, Taiwan
Abstract :
A multi-mode Low-Density Parity-Check (LDPC) error correction engine with a Digital Signal Processing (DSP) module is presented for low power and ultra high reliability NAND Flash memory controllers. The DSP module improves the reliability of the storage systems via calculating the adaptive reliability information and translating the information into Log-Likelihood Ratio (LLR) for soft bit decoding. According to the experiment results on sub-20nm Triple Level per Cell (TLC) NAND Flash memory, the retention ability of LDPC with DSP is a 20 times improvement over BCH code and 2 to 5 times improvement over conventional LDPC. Moreover, the proposed decoder reaches a throughput over 400MB/s as well as a power consumption of 21.8mW under 40nm CMOS technology at 45 bit errors.
Keywords :
BCH codes; CMOS memory circuits; NAND circuits; decoding; embedded systems; error correction codes; flash memories; integrated circuit reliability; low-power electronics; parity check codes; signal processing; BCH code; CMOS technology; DSP module; LLR; TLC; adaptive reliability information; digital signal processing; embedded NAND flash memory controller; log-likelihood ratio; low power LDPC error correction engine; multimode low-density parity-check error correction engine; power 21.8 mW; size 40 nm; soft bit decoding; storage system reliability; triple level per cell NAND flash memory; ultra high reliability LDPC error correction engine; word length 45 bit; Abstracts; Digital signal processing; Engines; Error correction codes; Parity check codes; Throughput; DSP and NAND Flash Controller; LDPC;
Conference_Titel :
VLSI Circuits Digest of Technical Papers, 2014 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4799-3327-3
DOI :
10.1109/VLSIC.2014.6858405