• DocumentCode
    1831490
  • Title

    Accurate estimation of total leakage current in scaled CMOS logic circuits based on compact current modeling

  • Author

    Mukhopadhyay, Saibal ; Raychowdhury, Arijit ; Roy, Kaushik

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2003
  • fDate
    2-6 June 2003
  • Firstpage
    169
  • Lastpage
    174
  • Abstract
    Dramatic increase of subthreshold, gate and reverse biased junction band-to-band tunneling (BTBT) leakage in scaled devices, results in the drastic increase of total leakage power in a logic circuit. In this paper a methodology for accurate estimation of the total leakage in a logic circuit based on the compact modeling of the different leakage current in scaled devices has been developed. Current models have been developed based on the exact device geometry, 2-D doping profile and operating temperature. A circuit level model of junction BTBT leakage (which is unprecedented) has been developed. Simple models of the subthreshold current and the gate current have been presented. Here, for the first time, the impact of quantum mechanical behavior of substrate electrons, on the circuit leakage has been analyzed. Using the compact current model, a transistor has been modeled as a sum of current sources (SCS). The SCS transistors model has been used to estimate the total leakage in simple logic gates and complex logic circuits (designed with transistors of 25nm effective length) at the room and at the elevated temperatures.
  • Keywords
    CMOS logic circuits; integrated circuit design; integrated circuit modelling; leakage currents; logic gates; summing circuits; CMOS logic circuits; SCS transistor model; accurate estimation; current modeling; doping profile; leakage current; logic circuit; quantum mechanical behavior; substrate electrons; sum of current sources; threshold voltage; tunneling leakage; CMOS logic circuits; Doping profiles; Geometry; Leakage current; Logic circuits; Semiconductor device modeling; Semiconductor process modeling; Solid modeling; Temperature; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2003. Proceedings
  • Print_ISBN
    1-58113-688-9
  • Type

    conf

  • DOI
    10.1109/DAC.2003.1218931
  • Filename
    1218931