DocumentCode
1831518
Title
IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging (Cat. No.98EX203)
fYear
1998
fDate
17-19 Sept. 1998
Abstract
The following topics were dealt with: ASICs; packaging techniques; power convertors; spacecraft packaging; 3D packaging; CAD tools; MCMs; power hybrids; heat sinks; and power modules
Keywords
application specific integrated circuits; hybrid integrated circuits; modules; multichip modules; packaging; power convertors; power electronics; reliability; space vehicle electronics; 3D packaging; ASICs; CAD tools; MCMs; heat sinks; packaging techniques; power convertors; power hybrids; power modules; spacecraft packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location
Chicago, IL, USA
Print_ISBN
0-7803-5033-2
Type
conf
DOI
10.1109/IWIPP.1998.722238
Filename
722238
Link To Document