Title :
On-module power converter incorporating embedded inductors
Author_Institution :
Sensors & Electron. Syst., Raytheon Syst. Co., El Segundo, CA, USA
Abstract :
Summary form only given, as follows. Distributed power architectures require high-density, low-profile, low-cost “on-module” converters to improve regulation and fault tolerance while reducing interconnect weight. Raytheon is developing VHF resonant power converters that are ideally suited for such applications. A key feature of this technology is the integration of all the circuit magnetic components into the circuit substrate
Keywords :
inductors; modules; resonant power convertors; Raytheon; VHF resonant power converters; distributed power architectures; embedded inductors; fault tolerance; high-density convertors; low-cost converters; low-profile convertors; magnetic components; on-module power converter; regulation; Fault tolerance; Inductors; Integrated circuit interconnections; Lab-on-a-chip; Magnetic circuits; Magnetic resonance; Power system interconnection; Road transportation; Sensor systems; VHF circuits;
Conference_Titel :
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-5033-2
DOI :
10.1109/IWIPP.1998.722241