Development of a stacked-plate technique for 3-D packaging of power electronics modules

Virginia Power Electronics Center (VPEC) has developed a stacked-plate technique for 3-D packaging of power electronics building block modules. A basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability has been constructed. This innovative packaging technique uses high-performance copper/aluminum nitride/copper sandwiched plates as substrates for power devices. To interconnect the devices, metal posts are soldered directly onto the devices instead of using wire bonding. Test and modeling results of the packaged modules showed the potential for low parasitics, excellent thermal management, and improved reliability