• DocumentCode
    1831634
  • Title

    Foundry-fabless collaboration for semiconductor SoC industry in Korea

  • Author

    Oh, Young H. ; Lee, Yoon J. ; Song, Jae ; Kim, Taek S.

  • Author_Institution
    Dongbu HiTek Semicond., Inc., Seoul
  • fYear
    2008
  • fDate
    3-5 Nov. 2008
  • Firstpage
    5
  • Lastpage
    8
  • Abstract
    The trends in ecosystem and dynamics of semiconductor SoC industry in Korea are described in this paper. For the past years, the development of SoC (System on Chip) fabless industries has been phenomenal in that the total revenue of fabless companies became remarkably high and a number of major players of which the sales is about $200 million are emerging in Korea. It was mainly on the basis of multimedia SoC integration into systems like mobile phones and digital TV which have been pivotal IT growth engines in Korea. In order to sustain the continuous growth, however, SoCs need to explore the new engines to which they should be expanded, e.g., energy savings, automotives and wireless networks. The new foundry-fabless collaboration areas like high voltage analog and mixed signals/RF are presented. They strongly demand process and design collaboration, are less sensitive to market fluctuations and thereby have relatively long product lifetime and ensure continuous growth while less investment is required in comparison with logic technology.
  • Keywords
    semiconductor industry; system-on-chip; Korea; automotives; digital TV; energy savings; foundry-fabless collaboration; high voltage analog; mixed signals-RF; mobile phones; multimedia SoC integration; semiconductor SoC industry; system on chip; wireless networks; Automotive engineering; Collaboration; Digital TV; Ecosystems; Engines; Marketing and sales; Mobile handsets; Multimedia systems; System-on-a-chip; Vehicle dynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2008. A-SSCC '08. IEEE Asian
  • Conference_Location
    Fukuoka
  • Print_ISBN
    978-1-4244-2604-1
  • Electronic_ISBN
    978-1-4244-2605-8
  • Type

    conf

  • DOI
    10.1109/ASSCC.2008.4708714
  • Filename
    4708714